Low-temperature technique of thin silicon ion implanted epitaxial detectors
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dc.type
JournalArticle
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dc.abstract.en
A new technique of large-area thin ion implanted silicon detectors has been developed within the R&D performed by the FAZIA Collaboration. The essence of the technique is the application of a low-temperature baking process instead of high-temperature annealing. This thermal treatment is performed after B+ ion implantation and Al evaporation of detector contacts, made by using a single adjusted Al mask. Extremely thin silicon pads can be therefore obtained. The thickness distribution along the X and Y directions was measured for a prototype chip by the energy loss of α-particles from 241Am (〈E α 〉 = 5.5 MeV). Preliminary tests on the first thin detector (area ≈ 20 × 20 mm2) were performed at the INFN-LNS cyclotron in Catania (Italy) using products emitted in the heavy-ion reaction 84Kr (E = 35 A MeV) + 112Sn. The ΔE − E ion identification plot was obtained using a telescope consisting of our thin ΔE detector (21 μm thick) followed by a typical FAZIA 510 μm E detector of the same active area. The charge distribution of measured ions is presented together with a quantitative evaluation of the quality of the Z resolution. The threshold is lower than 2 A MeV depending on the ion charge.
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dc.description.volume
51
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dc.description.number
2
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dc.description.publication
0,5
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dc.identifier.doi
10.1140/epja/i2015-15015-2
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dc.identifier.eissn
1434-601X
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dc.title.journal
The European Physical Journal. A, Hadrons and Nuclei
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dc.language.container
eng
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dc.affiliation
Wydział Fizyki, Astronomii i Informatyki Stosowanej : Instytut Fizyki im. Mariana Smoluchowskiego
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dc.subtype
Article
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dc.identifier.articleid
15
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dc.rights.original
CC-BY; inne; ostateczna wersja wydawcy; w momencie opublikowania; 0;