From April 2nd to April 5th, 2024, works related to the implementation of the new version of the Jagiellonian University Repository system will be carried out. It will not be possible to enter new information into the repository during this time. We apologize for any inconvenience.
The codeposition of tungsten with copper was studied. Thin, compact and hard micrometer-thick layers of a new, advanced Cu–W alloy with W content of above 10 at.% (26 wt.%) have been obtained by electrodeposition. The alloy was deposited on silver substrate from citrate plating baths under conditions of constant current and high tungstate–copper ion concentration ratio. Scanning electron microscopy (SEM), energy-dispersive spectroscopy (EDS), transmission electron microscopy (TEM) and X-ray diffraction (XRD) were used to characterize the alloys. The obtained results provide evidence for the first successful codeposition of significant amount of tungsten with a metal other than the one belonging to the triad iron group.